- #1
Mike_In_Plano
- 702
- 35
I'm looking to develop a process for direct deposition of temperature dependent resistive material on a hastelloy or pure nickel substrate. My problem is plating an insulating layer between the two materials.
I need the insulation to be fairly robust as it must survive a 500 volt dielectric test and it must survive bond wire application afterwards.
We've played with sputtering on dielectrics, but generally haven't had much success. Any ideas would be greatly appreciated.
Thanks,
Mike
I need the insulation to be fairly robust as it must survive a 500 volt dielectric test and it must survive bond wire application afterwards.
We've played with sputtering on dielectrics, but generally haven't had much success. Any ideas would be greatly appreciated.
Thanks,
Mike